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Thermoelectric P Proper roper roperties ties of Antimony T Telluride elluride Thin Films ilms Deposited using R R..F F. . Magnetron Sputtering


Paper Type 
Contributed Paper
Title 
Thermoelectric P Proper roper roperties ties of Antimony T Telluride elluride Thin Films ilms Deposited using R R..F F. . Magnetron Sputtering
Author 
Kandasamy andasamy andasamy, , S S*., ., P Pachoud, achoud, D., Holland, A., K Kalantar alantar alan
Email 
sasikaran@ieee.org
Abstract:
In this paper, we report the fabrication parameters for thin films (0.5-2 µm) of antimony telluride (p- type semiconductor) deposited using R. F. magnetron sputtering. Optimal deposition conditions were found to be at a sputtering power of 60 W, 5 cm distance between the sample and target, a substrate temperature of 50 °C and sputtering duration of 300 seconds. The Seebeck coefficient and electrical resistivity of these films were measured at room temperature (295 K). The Seebeck coefficient and the electrical resistivity of the antimony telluride was found to be approximately 213 µV/K and 585 µΩm, respectively. The microstructural characteristics of the thin films were investigated using Scanning Electron Microscopy and X-Ray Diffraction. The XRD analysis indicated the presence of monoclinic (SbTe), hexagonal (Sb2Te2) and rhombohedral (Sb2Te3) crystal structures.
Start & End Page 
459 - 464
Received Date 
Revised Date 
Accepted Date 
Full Text 
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Keyword 
antimony telluride, magnetron sputtering, Sb2Te3, Seebeck coefficient, thin film
Volume 
Vol.32 No.3 (SEPTEMBER 2005)
DOI 
Citation 
Andasamy K.A., S. S., . , Pachoud P., Achoud , D. , et al., Thermoelectric P Proper roper roperties ties of Antimony T Telluride elluride Thin Films ilms Deposited using R R..F F. . Magnetron Sputtering, Chiang Mai J. Sci., 2005; 32(3): 459-464.
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