Paper Type |
Contributed Paper |
Title |
Influences of Heat T reatment T emperature on Drawing Capabilities of Ti-Ni-Cu SMA Wire |
Author |
Pongpan Kaewtatip* and Anak Khantachawana |
Email |
pongpan.kae@kmutt.ac.th |
Abstract: The objective of this work is to investigate the influences of heat treatment temperatures on wire drawing capabilities of Ti-40Ni-10Cu (at%) shape memory alloy (SMA) over the range of 300-800 °C. Tensile tests have been conducted to collect the mechanical properties of the heat-treated wires. The heat-treated wires have been drawn at room temperature by using the die made of tungsten carbide. The initial diameter of the wire is 1.0 mm. The reduction ratio of cross-sectional area (%Reduction) and the die approach angle (semi-angle) are determined to be 18.5% and 10 degree, respectively. Drawing force, surface quality and dimension of the drawn wires are compared and analyzed.
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Start & End Page |
529 - 534 |
Received Date |
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Revised Date |
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Accepted Date |
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Full Text |
Download |
Keyword |
heat treatment, SMA Wire, Ti-Ni-Cu alloy, wire drawing |
Volume |
Vol.32 No.3 (SEPTEMBER 2005) |
DOI |
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Citation |
Kaewtatip P. and Khantachawana A., Influences of Heat T reatment T emperature on Drawing Capabilities of Ti-Ni-Cu SMA Wire, Chiang Mai J. Sci., 2005; 32(3): 529-534. |
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