Influences of Heat T reatment T emperature on Drawing Capabilities of Ti-Ni-Cu SMA Wire
Pongpan Kaewtatip* and Anak Khantachawana* Author for corresponding; e-mail address: pongpan.kae@kmutt.ac.th
Volume: Vol.32 No.3 (SEPTEMBER 2005)
Research Article
DOI:
Received: -, Revised: -, Accepted: -, Published: -
Citation: Kaewtatip P. and Khantachawana A., Influences of Heat T reatment T emperature on Drawing Capabilities of Ti-Ni-Cu SMA Wire, Chiang Mai Journal of Science, 2005; 32(3): 529-534.
Abstract
The objective of this work is to investigate the influences of heat treatment temperatures on wire drawing capabilities of Ti-40Ni-10Cu (at%) shape memory alloy (SMA) over the range of 300-800 °C. Tensile tests have been conducted to collect the mechanical properties of the heat-treated wires. The heat-treated wires have been drawn at room temperature by using the die made of tungsten carbide. The initial diameter of the wire is 1.0 mm. The reduction ratio of cross-sectional area (%Reduction) and the die approach angle (semi-angle) are determined to be 18.5% and 10 degree, respectively. Drawing force, surface quality and dimension of the drawn wires are compared and analyzed.