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Simulation and Experimental Research on the Influence of Copper Plating on the Surface of Silicon Carbide Particles (SiCp) on the Properties of SiCp/7075 Aluminum Matrix Composites
Paper Type  |
Contributed Paper |
Title |
Simulation and Experimental Research on the Influence of Copper Plating on the Surface of Silicon Carbide Particles (SiCp) on the Properties of SiCp/7075 Aluminum Matrix Composites |
Author |
Guo-Qiang Gan, Yu-Feng Zhang, Ke-Cheng Wang, Zhen Han and Ke-Min Xue |
Email |
ganguoqiang@hfut.edu.cn |
|
Abstract: With the further improvement of performance requirements for high-strength, high modulus, and high fatigue resistant aluminum based composites in the aerospace and weapon equipment fields, the existing silicon carbide aluminum based composites will no longer meet the requirements due to interface reactions between SiCp and aluminum matrix. This study uses numerical simulations and experiments to predict the effects of SiCp size, shape, content, and copper plating on the properties of composite materials. Using the spray deposition test method and deep drawing test for cylindrical parts, the influence of SiCp copper plating surface modification on the properties of aluminum based composite materials before and after were explored. The results indicated that the preparation of high-strength, high modulus, and high elongation particle reinforced aluminum matrix composites can be achieved through small particle size reinforcement particles, regular arrangement of reinforcement particles, and surface modification methods. Copper plating on the SiCp surface can be significantly improved the material elongation while ensuring high strength and high modulus, with an increase rate of 20%. This provides theoretical support for improving the plastic forming limit of SiC aluminum matrix composites and preparing complex parts. |
|
Article ID |
e2025013 |
Received Date |
2024-12-25 |
Revised Date |
2025-01-27 |
Accepted Date |
2025-01-28 |
Keyword |
SiCp, SiCp/Al composites, numerical simulation, surface modification |
Volume |
Vol.52 No.2 In progress (March 2025). This issue is in progress but contains articles that are final and fully citable. |
DOI |
https://doi.org/10.12982/CMJS.2025.013 |
Citation |
Gan G., Zhang Y., Wang K., Han Z. and Xue K., Simulation and Experimental Research on the Influence of Copper Plating on the Surface of Silicon Carbide Particles (SiCp) on the Properties of SiCp/7075 Aluminum Matrix Composites, Chiang Mai Journal of Science, 2025; 52(2): e2025013. DOI 10.12982/CMJS.2025.013. |
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