The Experimental Study on the Fabrication of SiCp/6092Al Graded Composite Materials Via ECAP Process
Guo-qiang Gan, Yong-tai Wang, Yu-feng Zhang, Ping Li and Rui-zhi Chai* Author for corresponding; e-mail address: ganguoqiang@hfut.edu.cn
ORCID ID: https://orcid.org/0009-0002-0237-0497
Volume :Vol.53 No.1 (January 2026)
Research Article
DOI: https://doi.org/10.12982/CMJS.2026.017
Received: 11 September 2025, Revised: 27 November 2025, Accepted: 8 December 2025, Published: -
Citation: Gan G.-q., Wang Y.-t., Zhang Y.-f., Li P. and Chai R.-z., The experimental study on the fabrication of SiCp/6092Al graded composite materials via ECAP process. Chiang Mai Journal of Science, 2026; 53(1): e2026017. DOI 10.12982/CMJS.2026.017.
Graphical Abstract
Abstract
Although traditional homogeneous SiCp reinforced aluminum matrix composites have characteristics such as high specific strength, low thermal expansion coefficient, and excellent wear resistance, but their isotropic properties are difficult to meet the gradient requirements of material properties under complex working conditions. Therefore, SiCp reinforced aluminum matrix composite gradient materials have attracted much attention in aerospace, defense and military industries. This study focuses on the preparation of SiCp/6092Al composite materials with different silicon carbide contents (15%, 20%, and 25%) using the powder metallurgy method. Gradient composite materials were prepared using the ECAP method, and the resulting variations in their microstructure and properties were systematically analyzed. The results indicate that: Based on powder metallurgy technology and large plastic deformation ECAP technology, SiCp/6092Al gradient composite materials with good interfacial bonding have been prepared, and the results of hardness and tensile strength tests show that compared with single volume fraction materials, the prepared gradient composite material has the characteristics of surface ablation resistance, intermediate layer high thermal conductivity, and matrix toughening.