Chiang Mai Journal of Science

Print ISSN: 0125-2526 | eISSN : 2465-3845

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Designed and Produced the Rotary Substrate Holder and Its Optimized in Angular DC Magnetron Co-Sputtering System

Preecha Changyom, Komgrit Leksakul, Nivit Charoenchai and Dheerawan Boonyawan
* Author for corresponding; e-mail address: komgrit@eng.cmu.ac.th
Volume: Vol.49 No.6 (November 2022)
Research Article
DOI: https://doi.org/10.12982/CMJS.2022.106
Received: 26 May 2022, Revised: 20 September 2022, Accepted: 12 October 2022, Published: -

Citation: Changyom P., Leksakul K., Charoenchai N. and Boonyawan D., Designed and Produced the Rotary Substrate Holder and Its Optimized in Angular DC Magnetron Co-Sputtering System, Chiang Mai Journal of Science, 2022; 49(6): 1633-1643. DOI 10.12982/CMJS.2022.106.

Abstract

     We report the design approach of a home-built rotary substrate holder on simple rotation stages for low-pressure vacuum applications. The result of designing and fabricating the rotary substrate holder that it can be successfully used to rotate the substrate in a low-pressure vacuum application without pressure fluctuations and leakage. Then we investigated the suitable thin film deposition by fabricating optimal multilayer coatings under three variable operating conditions: Speed of substrate, deposition time, and discharge voltage. The thin film deposition result of three copper targets was mounted on each magnetron gun, providing a total of three magnetron guns. The thin film was deposited on a glass slide at room temperature using a custom-built angular DC magnetron co-sputtering system. Analysis of variance for the response surface regression model of film thickness as a function of the three independent variables shows that substrate rotation speed, sputtering time, sputtering voltage, and coefficient of squared sputtering time are the most signifi cant factors in determining the optimum film thickness. The optimum thin-film deposition with substrate rotation speed, sputtering time, and sputtering voltage of 10 rpm, 8.61 min, and 200%V, respectively, maximizes the thickness of 72.036 nm.

Keywords: rotary substrate holder, angular sputtering, co-sputtering, multilayers sputtering

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