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Influence of Bath Formulations on Low-Temperature Electroless Deposition of Ni-P Alloys


Paper Type 
Contributed Paper
Title 
Influence of Bath Formulations on Low-Temperature Electroless Deposition of Ni-P Alloys
Author 
Chulaluk Somphotch , Ekasit Nisarattanaporna, Yuttanant Boonyongmaneeratb,*
Email 
yuttanant.b@chula.ac.th
Abstract:
 The influence of the concentrations of a metal source, a reducing agent, and hydrogen ions on the electroless deposition of Ni-P alloys is investigated at a relatively low deposition temperature of 65oC.  Hypophosphite and pH are determined to be the main controllers of the deposition rate.  Decent bath stability and a fair deposition rate of ~20 μm/hr, comparable to that obtained under the typical deposition temperature of ~85oC, are achievable by maintaining the nickel sulfate/sodium hypophosphite concentration ratio at ~0.4.  A moderately high sodium hypophosphite concentration of 0.38 M and a high pH of 9 and above are required. The empirical kinetics equations of the electroless nickel deposition are discussed and developed.

Start & End Page 
1332 - 1340
Received Date 
2013-04-04
Revised Date 
Accepted Date 
2013-07-26
Full Text 
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Keyword 
Electroless plating, nickel-phosphorus alloys, bath formulation, deposition characteristic
Volume 
Vol.41 No.5/2 (OCTOBER 2014)
DOI 
Citation 
Somphotch C., Nisarattanaporna E. and Boonyongmaneeratb Y., Influence of Bath Formulations on Low-Temperature Electroless Deposition of Ni-P Alloys, Chiang Mai J. Sci., 2014; 41(5/2): 1332-1340.
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Chiang Mai Journal of Science

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