Paper Type |
Contributed Paper |
Title |
Influence of Bath Formulations on Low-Temperature Electroless Deposition of Ni-P Alloys |
Author |
Chulaluk Somphotch , Ekasit Nisarattanaporna, Yuttanant Boonyongmaneeratb,* |
Email |
yuttanant.b@chula.ac.th |
Abstract: The influence of the concentrations of a metal source, a reducing agent, and hydrogen ions on the electroless deposition of Ni-P alloys is investigated at a relatively low deposition temperature of 65oC. Hypophosphite and pH are determined to be the main controllers of the deposition rate. Decent bath stability and a fair deposition rate of ~20 μm/hr, comparable to that obtained under the typical deposition temperature of ~85oC, are achievable by maintaining the nickel sulfate/sodium hypophosphite concentration ratio at ~0.4. A moderately high sodium hypophosphite concentration of 0.38 M and a high pH of 9 and above are required. The empirical kinetics equations of the electroless nickel deposition are discussed and developed.
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Start & End Page |
1332 - 1340 |
Received Date |
2013-04-04 |
Revised Date |
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Accepted Date |
2013-07-26 |
Full Text |
Download |
Keyword |
Electroless plating, nickel-phosphorus alloys, bath formulation, deposition characteristic |
Volume |
Vol.41 No.5/2 (OCTOBER 2014) |
DOI |
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Citation |
Somphotch C., Nisarattanaporna E. and Boonyongmaneeratb Y., Influence of Bath Formulations on Low-Temperature Electroless Deposition of Ni-P Alloys, Chiang Mai J. Sci., 2014; 41(5/2): 1332-1340. |
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