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Ex-situ EBSD Study on the Abnormal Grain Growth in 6063 Aluminum Billet


Paper Type 
Contributed Paper
Title 
Ex-situ EBSD Study on the Abnormal Grain Growth in 6063 Aluminum Billet
Author 
Kanokwan Uttarasak, Wanchai Chongchitnan, Kenji Matsuda, Julathep Kajornchaiyakul and Chaiyasit Banjongprasert
Email 
chaiyasit.b@cmu.ac.th
Abstract:

The abnormal grain growth can occur in 6063 aluminum billet during homogenization. This behavior relates to the boundary migration and grain coalescence during homogenization. The Fe-containing intermetallics give strong retardation of boundary migration in 6063 aluminum alloy. The low (0.089wt.%Fe) and high (0.170wt.%Fe) containing 6063 aluminum billets were studied to gain an in-depth understanding of the individual of grain migration, grain coalescence, and abnormal grain growth in 6063 aluminum billet during homogenization. Ex-situ electron backscatter diffraction (Ex-situ EBSD) was extensively used to characterize those behaviors. Ex-situ EBSD results indicate that abnormal grain growth in 6063 aluminum billets is correlated to the migration of high angle boundary, which changes from a high angle to low angle grain boundary and to abnormal grain growth. The Fe-rich intermetallics prevent boundary movements and play an important role in recrystallization and abnormal grain growth. 

Keywords: Electron Backscatter Diffraction (EBSD), 6063 Aluminum Alloy, Abnormal Grain Growth, Recrystallization, Homogenization

Start & End Page 
242 - 258
Received Date 
2019-09-20
Revised Date 
2019-11-20
Accepted Date 
2019-11-28
Full Text 
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Keyword 
Electron Backscatter Diffraction (EBSD), 6063 aluminum alloy, abnormal grain growth, recrystallization, homogenization
Volume 
Vol.47 No.2 (Special Issue I : March 2020)
DOI 
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